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芯片框图
基本规格
CPU• Quad-Core ARM Cortex™-A53 1.8GHz • 32KB L1 I-cache + 32KB L1 D-cache per core• 512KB L2 cache • Low-power CoolFlexTM power management architecture GPU
• Mali-T760 624MHz
Memory• Supports 32-bit DDR3/DDR3L/LPDDR3/LPDDR2
• Supports eMMC 5.0, support Full Disk Encryption(FDE) • Supports 8-bit TLC/MLC/SLC/EF NAND flash with 80-bit ECC, support FDE Video• Supports HEVC decoder 6K@30fps,4K@60fps
• Supports H.264/ VP9 decoder 4K@30fps • Supports multi-format 1080P@60fps video playback, including VP8,MPEG1/2, MPEG4 SP/ASP L5, H.263, WMV9/VC-1 • Supports H264 HP encoder 1080P@30fps • Supports macro block bit rate control • Supports JPEG encoder 4096X4096 |
Camera• Supports 8/10bit DC interface
• Supports BT656 interface • Supports ITU-R BT.656 time-multiplexed format • Supports image crop function • Maximum still capture resolution for parallel interface to 5M • Maximum video capture resolution for parallel interface to 1080P@30fps Audio• Supports stereo ADC and DAC
• Supports five analog audio inputs and three analog audio outputs • Capless headphone driver Display• Supports output resolution up to 1440x2560@70fps or 1440x1440x2@90fps
• Supports dual Display Engine for high-end VR • Supports SmartColorTM3.0 for excellent display experience • Supports Frame Packing/Top-and-Bottom/Side-by-Side Full/Side-by-Side Half 3D format data • Supports hardware accelerator “Portal ”for ATW, distortion correction,chromatic aberration correction |
Sensor• Supports built-in Sensor Hub
• Supports 9-axis sensor, including accelerometer, gyroscope, magnetometer • Supports ambient light and proximity sensor Connectivity• USB Host, USB 2.0 OTG
• SDIO 3.0,RSB • 8x TWI,3x SPI • 5x UART,3x PWM • GPADC WIFI• Supports IEEE 802.11 a/b/g/n/ac
OS• Android 7.1 and above
PMIC• Customized AXP802
Package• FCBGA 463
• 15mm x 15mm size,0.65 pitch,0.35 ball size Process• 28nm HPC
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方案亮点
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VR专用加速模块&屏显系统
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VR专用影音&交互系统
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低发热功能&高安全品质
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完整的VR软件系统方案
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